Collaboration Parties

1. Hong Kong Productivity Council (local). They have some of the flipchip surface mount assembly and reliability testing facilities in place, which will be useful for this project. These facilities were funded by a previous Industry Department project.



2. Fraunhofer Institute-Technical University of Berlin (Germany), who is the leader in the area of low-cost flip chip technology using screenprinting technology, will be our consultants on an as-needed basis.



3. Georgia Tech Packaging Research Center, (U.S.A.) will also be our consultants on an as needed basis.



4. Epack Laboratory of Hong Kong University of Science and Technology, will provide the SMT and reliability equipment.



5. Microelectronic Fabrication Facility, will provide the wafer preparation process and equipment.



6. Material Characterization Preparation Facility, will provide the sputtering process and SEM equipment.