Philip Ching Ho CHAN (PhD, Illinois, 1978)

E-mail "eepchan@ee.ust.hk"

Research Interests


VLSI devices, circuits; Advance Integrated Circuits Packaging; Integrated Micro Systems.

Professor Chan was born in Shanghai and raised in Hong Kong. He received his BS degree in Electrical Engineering from the University of California at Davis, where he graduated with highest honors and departmental citation. He received his MS and PhD degrees in Electrical Engineering from the University of Illinois at Urbana-Champaign. Professor Chan stayed at Illinois initially as an IBM Postdoctoral Fellow and later as Visiting Assistant Professor in Electrical Engineering. At Illinois, Professor Chan engaged in semiconductor device and material research. He also taught undergraduate and postgraduate courses in semiconductor devices. Professor Chan joined Intel Corporation, Santa Clara, California in 1981 as a Senior Engineer in the Technology Development Computer-Aided Design Department. Later he became a Principal Engineer and Senior Project Manager, leading a team of eight engineers and two technicians. Professor Chan has the corporate responsibility for circuit simulation tools, VLSI device modeling and process characterization. In 1990, Professor Chan transferred to the Design Technology Department of Microproducts Group. There he led a team of engineers that defined and developed a CAD system to design multi-chip module products. This effort led to the first functional 486 based multi-chip module at Intel. He joined the Hong Kong University of Science of Technology in April 1991 as a Reader. He served as the Director of Undergraduate Studies. He was the founding Director of Computer Engineering Program. He served as the Associate Dean of Engineering from 1 January 1994 to 31 December 1994. He was the Acting Head from 18 September 1995 to 31 March 1997 and has been the Head of Electrical & Electronic Engineering since 1 April 1997.

Recent Publications