Editors' Contact

G. Abreu University of Oulu giuseppe@ee.oulu.fi S. Affes INRS-EMT Sofiene.Affes@emt.inrs.ca S.Aissa Universite du Quebec aissa@emt.inrs.ca M. Ardakani University of Alberta ardakani@ece.ualberta.ca N. Arumugam King's College London arumugam.nallanathan@kcl.ac.uk S. Bhashyam Indian Institute of Technology Madras skrishna@ee.iitm.ac.in S. Blostein Queen's University sdb@ee.queensu.ca R. M. Buehrer Virginia Tech buehrer@vt.edu R. Cheng Hong Kong Univ. of Science and Tech. eecheng@ust.hk A. Chockalingam Indian Institute of Science achockal@ece.iisc.ernet.in W. Choi Inform. and Commun. University Korea wchoi@ee.kaist.ac.kr C. C. Chong DoCoMo USA Labs Chia-Chin.Chong@ieee.org G. Colavolpe University of Parma giulio@unipr.it J. Coon Toshiba Telecomm. Research Lab. Justin.Coon@Toshiba-Trel.com C. Cordeiro Intel Corporation Carlos.Cordeiro@intel.com F. A. Cruz-Perez CINVESTAV-IPN facruz@cinvestav.mx O. Dabeer Tata Institute of Fundamental Research onkar@tcs.tifr.res.in D. Dardari University of Bologna at Cesena ddardari@ieee.org T. N. Davidson McMaster University davidson@mcmaster.ca L. Deneire University of Nice deneire@i3s.unice.fr X. Dong University of Victoria xdong@ece.uvic.ca G. D. Durgin Georgia Institute of Technology durgin@ece.gatech.edu X. Gao Southeast University China xqgao@seu.edu.cn D. Gesbert Eurecom Institute gesbert@eurecom.fr S. S. Ghassemzadeh AT&T Labs - Research saeedg@research.att.com A. Guillen i Fabregas University of Cambridge guillen@ieee.org A. Gulliver University of Victoria a.gulliver@ieee.org I. Habib City University of New York habib@ccny.cuny.edu A. Hjorungnes University of Oslo arehj@unik.no D. Hong Yonsei University daesikh@yonsei.ac.kr E. Hossain University of Manitoba ekram@ee.umanitoba.ca M. J. Hossain INRS-EMT jahangir.hossain@emt.inrs.ca T. Hou Virginia Tech thou@vt.edu D. Huang The University of Western Australia huangdf@ee.uwa.edu.au H. Jafarkhani University of California Irvine hamidj@uci.edu N. Kato Tohoku University kato@it.ecei.tohoku.ac.jp D. I. Kim Sungkyunkwan University Korea dikim@ece.skku.ac.kr I. M. Kim Queen's University ilmin.kim@queensu.ca K. S. Kim Yonsei University ks.kim@yonsei.ac.kr Y. C. Ko Korea University koyc@korea.ac.kr L. Lampe University of British Columbia lampe@ece.ubc.ca V. K. N. Lau Hong Kong Univ. of Science and Tech. eeknlau@ee.ust.hk I. Lee Korea University inkyu@korea.ac.kr K. B. Lee Seoul National University klee@snu.ac.kr Y. Li Georgia Institute of Technology liye@ece.gatech.edu B. Liang University of Toronto liang@comm.utoronto.ca W. Liao National Taiwan University wjliao@cc.ee.ntu.edu.tw W. Lou Worcester Polytechnic Institute wjlou@ece.wpi.edu J. Lu Tsinghua University lujh@wmc.ee.tsinghua.edu.cn Luo J. Colorado State University rockey@engr.colostate.edu X. Ma Georgia Institute of Technology xiaoli@ece.gatech.edu R.K. Mallik Indian Institute of Technology Delhi rkmallik@ee.iitd.ac.in G. D. Mandyam Qualcomm giridhar.mandyam@yahoo.com N. Mehta Indian Institute of Science nbmehta@ece.iisc.ernet.in M. L. Merani University of Modena and Reggio Emilia marialuisa.merani@unimore.it A. F. Molisch University of Southern California Andreas.Molisch@ieee.org M. Morelli University of Pisa michele.morelli@iet.unipi.it R. Nabar Marvell Semiconductor rnabar@marvell.com H. Nguyen University of Saskatchewan ha.nguyen@usask.ca A. Nosratinia University of Texas at Dallas aria@utdallas.edu H. Ochiai Yokohama National University hideki@ynu.ac.jp J. C. Olivier University of Pretoria corne.olivier@eng.up.ac.za C. B. Papadias Athens Information Technology papadias@ait.edu.gr F. N. Pavlidou Aristotle University niovi@auth.gr B. S. Rajan Indian Institute of Science bsrajan@ece.iisc.ernet.in D. Reynolds West Virginia University Daryl.Reynolds@mail.wvu.edu A. Sabharwal Rice University ashu@rice.edu Nikos C. Sagias University of Peloponnese Greece nsagias@ieee.org Y. Sanada Keio University sanada@elec.keio.ac.jp A. Sezgin Ulm University aydin.sezgin@uni-ulm.de M. Shafi Telecom New Zealand Mansoor.Shafi@telecom.co.nz J. M. Shea University of Florida jshea@ece.ufl.edu H. Shin Kyung Hee University hshin@khu.ac.kr O. Simeone New Jersey Institute of Technology osvaldo.simeone@njit.edu F. Takawira University of KwaZulu-Natal ftakaw@ukzn.ac.za M. Tao Shanghai Jiao Tong University mxtao@sjtu.edu.cn D. Tarchi University of Florence tarchi@lenst.det.unifi.it C. Tellambura University of Alberta chintha@ee.ualberta.ca M. Torlak The University of Texas at Dallas torlak@utdallas.edu F. Tufvesson Lunds University fredrik.tufvesson@es.lth.se J. K. Tugnait Auburn University tugnait@eng.auburn.edu M. Uysal University of Waterloo muysal@ece.uwaterloo.ca M.C. Valenti West Virginia University mvalenti@wvu.edu G. M. Vitetta Univ. of Modena and Reggio Emilia giorgio.vitetta@unimo.it X. Wang University of Western Ontario wang@eng.uwo.ca S. Wei Louisiana State University swei@ece.lsu.edu M. Win Massachusetts Institute of Technology moewin@mit.edu K. K. Wong University College London k.wong@adastral.ucl.ac.uk X. G. Xia University of Delaware xxia@ee.udel.edu C. Xiao Missouri University of S&T xiaoc@mst.edu G. Xue Arizona State University xue@asu.edu H. C. Yang University of Victoria hyang@ece.uvic.ca L. Yang The University of Florida lqyang@ece.ufl.edu C. Yang Beihang University cyyang@buaa.edu.cn A. Yener The Pennsylvania State University a.yener@ieee.org D. Zeghlache Institut National des Telecommunications djamal.zeghlache@int-evry.fr Q. Zhang Johns Hopkins University qinqing@ieee.org Y. J. Zhang The Chinese University of Hong Kong yjzhang@ie.cuhk.edu.hk