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Volkan KURSUN
Ph.D., University of Rochester, New York, USA
M.S., University of Rochester, New York, USA
B.S., Middle East Technical University, Ankara, Turkey
Assistant Professor
Dept of Electronic & Computer Engineering, HKUST
Tel : +852 2358 7043
Email : eekursun
Room : 2532
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Research Interests
Emerging Integrated Circuit Technologies, Power-Aware Design, High Efficiency and High Quality Power Generation and Delivery, Parameter Variations - Design for Manufacturability, On-Chip Noise, Interconnect-Aware Design

Biography

Volkan Kursun received the B.S. degree in Electrical and Electronics Engineering from the Middle East Technical University, Ankara, Turkey in 1999, and the M.S. and Ph.D. degrees in Electrical and Computer Engineering from the University of Rochester, New York, USA in 2001 and 2004, respectively.

He performed research on mixed-signal thermal inkjet integrated circuits with Xerox Corporation, Webster, New York, USA in 2000. During summers 2001 and 2002, he was with Intel Microprocessor Research Laboratories, Hillsboro, Oregon, USA responsible for the modeling and design of high frequency monolithic power supplies. During summer 2008, he was a visiting professor at the Chuo University, Tokyo, Japan. He served as an assistant professor in the Department of Electrical and Computer Engineering at the University of Wisconsin - Madison, USA from August 2004 to August 2008. He has been an assistant professor in the Department of Electronic and Computer Engineering at the Hong Kong University of Science and Technology, People’s Republic of China since August 2008.

His current research interests are in the areas of low voltage, low power, and high performance integrated circuit design, modeling of semiconductor devices, and emerging integrated circuit technologies.

Dr. Kursun serves on the technical program and organizing committees of the IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), the ACM/SIGDA Great Lakes Symposium on VLSI (GLSVLSI), the IEEE International Symposium on Circuits and Systems (ISCAS), the IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), the IEEE/ACM International Symposium on Quality Electronic Design (ISQED), the IEEE/ACM Asia Symposium on Quality Electronic Design (ASQED), and the IEEE Asian Solid-State Circuits Conference (A-SSCC).

He served on the editorial board of the IEEE Transactions on Circuits and Systems II (TCAS-II) from 2005 to 2008. Dr. Kursun is an associate editor of the Journal of Circuits, Systems, and Computers (JCSC), the IEEE Transactions on Very Large Scale Integration Systems (TVLSI), and the IEEE Transactions on Circuits and Systems I (TCAS-I).


Research Interests

Emerging Integrated Circuit Technologies

· Multiple gate MOSFETS

· Carbon nanotube and graphene based devices and interconnect

· Modeling and characterization of emerging nanometer devices

· Thermal issues in 3D integration

· 3D design for testability

· Novel 3D integrated circuits for high yield

Power-Aware Design

· Self-sustaining ultra-low power integrated systems

· Energy scavenging technologies

· Gate-oxide tunneling and subthreshold leakage current reduction techniques

· Multiple supply and threshold voltage CMOS

· Globally asynchronous locally synchronous microprocessors

· Dynamic voltage and frequency scaling

· Subthreshold logic circuits

· Die-hard technologies for extreme environments

 High Efficiency and High Quality Power Generation and Delivery

· Power distribution network analysis

· Power supply noise cancellation methods

· Monolithic power supplies

Parameter Variations - Design for Manufacturability

· Reliability and yield issues in scaled nanometer integrated circuits

· Process parameter variations

· Supply voltage variations

· Temperature variations

· Parameter variation tolerant IC design

· Statistical power analysis and optimization techniques

On-Chip Noise

· Noise analysis and noise suppression techniques

· Shielding

· Repeater insertion

· Radiation hardening

· Soft-error tolerant technologies

Interconnect-Aware Design

· Resistive-capacitive-inductive interconnect modeling

· Low power signaling techniques


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