TRS-LED Seminar Series
Integrated capacitors for power system-on-chip applications

by Dr. Xiaodong Huang
     Post-Doctoral Fellow, ECE Dept, HKUST

 :  23 Oct 2013 (Wed)
 :  2:00pm - 3:00pm
Venue  :  ECE Conference Room 2512, 2/F (Lifts 25/26), HKUST

Power electronics development in the near future is moving towards power system-on-chip (Power SoC) to achieve system miniaturization, cost reduction as well as performance improvement. Integrated capacitors with high capacitance density and high performance are essential to achieve Power SoC. However, conventional planar integrated capacitors can hardly meet these requirements.
This talk will focus on high-density integrated capacitors. Firstly, a review of the current progress in the area regarding capacitor structures, materials and fabrication processes will be introduced. Then, a novel embedded multilayer integrated capacitor will be proposed and described. Compared with other high-density integrated capacitors, this proposed capacitor utilizes a small surface area and has a small form factor. Furthermore, it can be built using a simple and reliable fabrication process. It is expected that a compact monolithic system-on-a-chip with high integration density and small form factor can be made using this capacitor.
Xiaodong Huang received his Ph.D. degree in Electrical and Electronic Engineering from the University of Hong Kong in March, 2013. He has been a post-doctoral fellow in the Department of Electrical and Computer Engineering, the Hong Kong University of Science and Technology since May, 2013. His research interests include high-k materials combined with their applications in electronic devices, and high-density passives and integration techniques.