Events

 
TRS-LED Seminar Series
TRS-LED Seminar Series

Titles & Speakers:
1) Understanding the Brightness, Color, Thermal, and Electrical Performances of LED and their Relationship to Efficiency of SSL
by Prof. Ricky Lee
    Professor of Mechanical Engineering, HKUST
    Director of Center for Advanced Microsystems Packaging
    Director of HKUST LED-FPD Technology R&D Center at Foshan

2) Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
by Mr.  Fred Le
    PhD candidate, Department of Mechanical Engineering, HKUST


Date
 :  10 May 2013 (Fri)
Time
 :  3pm - 4:30pm
Venue  :  ECE Conference Room 2512, 2/F (Lift 25/26), HKUST

Abstracts:
1) Understanding the Brightness, Color, Thermal, and Electrical Performances of LED and their Relationship to Efficiency of SSL
LED has been claimed as the 4th generation light source which has the major merits of rather low power consumption and very long service life. Typical specifications include 150 lm/W and 50000 hours for luminous efficacy and operating life, respectively. However, it appears that not all people understand what these specifications refer to and imply. As a result, inappropriate expectation may occur due to misperception. Consequently, such misunderstanding may hinder the propagation of LED for solid-state lighting (SSL). In this presentation, the essence of LED packaging for SSL will be reviewed. Various topics on efficiencies and their corresponding loss channels at the LED package and luminaire levels will be discussed. Emphasis will be placed on the trends of LED packaging in order to achieve the intended performance.
 
2) Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
As packaging technology is moving toward the technique of 3D packaging with flip-chips and through silicon vias (TSVs), the demands for underfill encapsulation also arise with the increasing stacked layers. In this presentation, a combined I-Pass/TSV underfill dispensing process is introduced for 3D stacked-die package with TSVs, and then a 3D package prototype with four vertical levels is developed for concept validation. In the underfill dispensing process, conventional I-pass underfill is used to fill up the gaps of bottom two levels as it has relatively fast spreading speed. For the top two levels, underfill is dispensed through TSVs other than edges. After encapsulation process, both nondestructive evaluation and cross-section inspection are performed to verify the effect of underfill dispensing.
 

Biography:
Prof. Ricky Lee
Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of nine best/outstanding paper awards and three major professional society awards, Dr Lee is Fellow of IEEE, ASME, and Institute of Physics (UK). He is also a Distinguished Lecturer of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society. Furthermore, Dr Lee was elected President of IEEE CPMT Society in 2011 and is serving for the term of 2012-2013.
 
Mr. Fred Le
Fred Le received his bachelor degree in 2005 and master degree in 2007, both from Wuhan University, China. Then he joined Chinese Academy of Sciences (Shenzhen) for four years. At present, he is a PhD candidate in the group of Prof. Ricky Lee in mechanical engineering department of HKUST.
 

Light refreshment will be served at the end of the seminar.
(The seminar is FREE while registration is needed. Please register HERE)